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Digi ConnectCore® 8M Mini, based on the NXP® i.MX 8M Mini application processor, is a secure integrated system-on-module (SOM) platform. The Mini is designed for a wide range of industrial, medical, agricultural and transportation applications, including Internet of Things (IoT), human-machine interface (HMI), equipment monitoring, audio/voice, graphics/video, edge computing and machine learning.
Digi ConnectCore 8M Mini features four power-efficient Arm® Cortex®-A53 cores, one Cortex-M4 core, and the Digi Microcontroller Assist Cortex-M0, which allow it to minimize power consumption while maintaining a high standard of performance. With a 10+ year product lifecycle, OEMs can reduce their development costs and achieve a lower total cost of ownership by leveraging pre-certified wireless connectivity, remote management, cloud integration, and complete Linux Yocto Project and Android software platform support.
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SPECIFICATIONS
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Digi ConnectCore® 8M Mini
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APPLICATION PROCESSOR
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NXP® i.MX8 Mini
- Four Cortex®-A53 cores @ 1.6 GHz
- Cortex-M4 400 MHz core processor for low-power processing
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MEMORY
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Up to 8 GB eMMC, up to 2 GB of LPDDR4 (32-bit)
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PMIC
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NXP PCA9450
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GRAPHICS / VIDEO
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Graphic Processing Unit:
- GCNanoUltra for 3D acceleration
- GC320 for 2D acceleration
- LCDIF display controller, supporting up to 1080 p 60 fps display through MIPI DSI
- MIPI DSI (4-lane) with PHY (display interface)
- MIPI CSI (4-lane) with PHY (camera interface)
Video Processing Unit:
- 1080 p 60 HEVC H.265 (decode)
- VP9, H.264, VP8 (encode/decode)
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SECURITY
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Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
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PERIPHERALS / INTERFACES
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1x PCI Express 2.0 (PCIe)
2x USB 2.0 OTG controllers with integrated PHY interfaces
3x Ultra Secure Digital Host Controller (uSDHC) interfaces
5x Universal Asynchronous Receiver / Transmitter (UART) modules
4x I2C modules
3x SPI modules
1x Quad SPI
10x PWM channels
1x 16-bit ADC module with accurate internal voltage reference, up to 20 channels
5x Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, codec/DSP and DSD interfaces
1x S/PDIF input and output, including a raw capture input mode
8-channel Pulse Density Modulation (PDM) input
Up to 112 GPIOs
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ETHERNET
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10/100/1000M Ethernet + AVB
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WI-FI
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802.11a/b/g/n/ac dual-band wireless
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BLUETOOTH
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Bluetooth® 5
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ON-MODULE MICROCONTROLLER ASSIST
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Digi Microcontroller Assist™
- Independent Cortex-M0+ microcontroller subsystem
- Supporting ultra-low power modes @ <3µA
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OPERATING TEMPERATURE
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Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design
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STORAGE TEMPERATURE
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-50° C to 125° C (-58° F to 257° F)
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RELATIVE HUMIDITY
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5% to 90% (non-condensing)
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RADIO APPROVALS
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US, Canada, EU, Japan, Australia/New Zealand
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EMISSIONS / IMMUNITY / SAFETY
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FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17,
EN 55024, EN 301 489-3, Safety (IEC 62368-1)
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DESIGN VERIFICATION
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Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
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MECHANICAL DIMENSIONS
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118 castellated vias, LGA-474, 1.27 mm pitch, 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
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PRODUCT WARRANTY
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3-year
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Features
- Industrial i.MX 8M Mini quad-core system-on-module
- Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability and design freedom
- Power management with both hardware and software support for low-power designs
- Display and camera capabilities with graphics and video hardware acceleration
- Video capabilities with built-in VPU
- Pre-certified dual-band 802.11a/b/g/n/ac 1x1 and Bluetooth® 5 connectivity
- Seamless cellular modem and Digi XBee® wireless integration
- Cloud and edge-compute services integration
- Built-in device security, identity and privacy with Digi TrustFence® and a hardware Secure Element
- Remote monitoring and management with Digi Remote Manager®
- Yocto Project Linux and Android support
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